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Global 3D ICs Market to Grow at 18.1% CAGR till 2019, Thanks to Growing Demand from the ICT Industry

One of the most influential trends shaping the global 3D ICs market is that of the multi-chip packaging of 3D ICs and its incorporation in several transistors. The technology of multi-chip packaging has revolutionized the packaging technique used for ICs. A 3D IC is an IC which comes with multiple layers of active electronic parts, which are integrated in a single circuit. The layers present in a 3D IC are integrated both horizontally and vertically. 3D ICs have emerged as the perfect solution to meet the accelerating demand to minimize the size and optimize the cost of products in the consumer electronics segment. 3D ICs are derived from the continuous technological advancements in IC designs.

Global 3D ICs Market to be worth US$7.52 Billion by 2019

The global 3D ICs market is significantly driven by the growing demand for 3D ICs in memory products such as DRAM and flash memory. These chips enhance the reliability and performance of memory products and optimize their cost and size. Nevertheless, factors such as the high cost of 3D ICs along with their thermal and testing issues will suppress the global 3D ICs market. According to a market research firm, the global 3D ICs market is predicted to grow at a marked CAGR of 18.1% during the forecast period from 2013 to 2019. The global 3D ICs market was valued at US$2.4 billion in 2012 and is estimated to reach US$7.52 billion by 2019.

MEMs and Sensors and Memories Segment to Dominate the Market

By product, the global 3D ICs market is segmented into HB LED, logic (3D Soc/Sip), memories (3D stacks), RF SiP, MEMs and sensors, and optoelectronics and imaging. The segments – memories and MEMs and sensors together are expected to dominate the market in the foreseeable future. Increasing popularity of memory-enhanced solutions will fuel the demand for memories segment. Based on substrate, the global 3D ICs market is divided into bulk silicon and SOI (silicon on insulator).

By end use, the global 3D ICs market is classified into information and communication technology (ICT), consumer electronics, military, transport, and others. The majority of revenue of the global 3D ICs market is generated by the ICT industry. Factors such as enhanced storage strength for high rendition networking devices and elevated bandwidth capabilities will add to the demand for 3D ICs in the ICT industry. On the basis of fabrication process, the global 3D ICs market is categorized into wafer bonding, beam re-crystallization, solid phase crystallization, and silicon epitaxial growth.

Asia Pacific to Lead the Global 3D ICs Market till 2019

Geographically, the global 3D ICs market is divided into North America, Asia Pacific, Europe, and Rest of the World (RoW). Asia Pacific is projected to emerge as the largest regional sector in the global 3D ICs market as a result of the growth brought about by the region’s booming consumer electronics and ICT industry. The second leading regional market is expected to be North America.

A large number of companies from the semiconductor and packaging industry have ventured in this industry, realizing the huge growth potential of the 3D ICs market. Moreover, companies understand that there is tremendous potential for mass production of 3D ICs. The top three companies in the global 3D ICs market are Samsung Electronics, Xilinx, and Taiwan Semiconductor Manufacturing Company. Other notable players in the market are Micron Technology, Intel, United Microelectronics, Monolithic 3D, and STATS ChipPAC.

Browse Full Global 3D ICs Market Report With Complete TOC @

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